The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Dec. 04, 2013
Applicant:

Tsmc Solid State Lighting Ltd., Hsinchu, TW;

Inventors:

Chih-Kuang Yu, Chiayi, TW;

Hung-Yi Kuo, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 21/60 (2006.01); H01L 23/498 (2006.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/06 (2010.01); H01L 33/08 (2010.01); H01L 33/40 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/005 (2013.01); H01L 33/0079 (2013.01); H01L 33/06 (2013.01); H01L 33/08 (2013.01); H01L 33/382 (2013.01); H01L 33/405 (2013.01); H01L 33/486 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A structure includes a carrier substrate with a first side and a second side opposite the first side. The carrier substrate has a first contact pad and a second contact pad disposed over the first side and a third contact pad and a fourth contact pad disposed over the second side. The carrier substrate further includes a substrate and an insulation film disposed between the substrate and the first, second, third, and fourth contact pads. The structure further includes a first epi-structure and a second epi-structure disposed over the carrier substrate. The structure further includes a first metal element and a second metal element. Moreover, the structure further includes a first through-via and a second through-via. The first through-via and the second through-via extend through the first and second epi-structures respectively.


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