The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Aug. 29, 2011
Applicants:

Tobias Gebuhr, Regensburg, DE;

Hans-christoph Gallmeier, Regensburg, DE;

Andreas Weimar, Regensburg, DE;

Inventors:

Tobias Gebuhr, Regensburg, DE;

Hans-Christoph Gallmeier, Regensburg, DE;

Andreas Weimar, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 33/56 (2010.01); H01L 25/16 (2006.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/18 (2013.01); H01L 24/24 (2013.01); H01L 33/56 (2013.01); H01L 25/167 (2013.01); H01L 33/50 (2013.01); H01L 33/60 (2013.01); H01L 2224/18 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0091 (2013.01);
Abstract

A method of producing a component including providing a carrier having a top, an underside, and at least one connection area, applying an optoelectronic component to the top, wherein the optoelectronic component has a contact area facing away from the carrier, applying insulating material to the contact and connection areas, wherein the insulating material is free of foreign particles, applying an insulating layer to exposed places of the insulating material, optoelectronic component and carrier, wherein the insulating layer includes foreign particles in a predefinable concentration, removing the insulating layer in a region above the contact and/or connection areas, to produce openings, removing the insulating material in a region above the contact and connection areas, thereby producing at least two openings in the insulating material, and arranging conductive material on the insulating layer and at least in places in the openings, wherein conductive material conductively connects the contact and connection areas.


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