The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Nov. 16, 2011
Applicants:

Jean-marc Bethoux, Grenoble, FR;

Pascal Guenard, Froges, FR;

Inventors:

Jean-Marc Bethoux, Grenoble, FR;

Pascal Guenard, Froges, FR;

Assignee:

SOITEC, Bernin, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/32 (2010.01); H01L 21/762 (2006.01); H01L 33/00 (2010.01); H01L 31/18 (2006.01); H01L 33/40 (2010.01); H01S 5/042 (2006.01); H01S 5/323 (2006.01);
U.S. Cl.
CPC ...
H01L 33/32 (2013.01); H01L 21/76254 (2013.01); H01L 31/1852 (2013.01); H01L 31/1856 (2013.01); H01L 31/1892 (2013.01); H01L 33/0075 (2013.01); H01L 33/0079 (2013.01); H01L 33/40 (2013.01); H01L 2924/0002 (2013.01); H01S 5/0425 (2013.01); H01S 5/32341 (2013.01); H01S 2301/173 (2013.01); Y02E 10/544 (2013.01);
Abstract

The invention relates to a method for fabricating a structure including a semiconductor material comprising: a) implanting one or more ion species to form a weakened region delimiting at least one seed layer in a substrate of semiconductor material, b) forming, before or after step a), at least one metallic layer on the substrate in semiconductor material, c) assembling the at least one metallic layer with a transfer substrate, then fracturing the implanted substrate at the weakened region, and d) forming at least one layer in semiconductor material on the at least one seed layer, for example, by epitaxy.


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