The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Sep. 12, 2012
Applicants:

Wei-yu Yen, Taichung, TW;

Fu-bang Chen, Taichung, TW;

Chih-sung Chang, Taichung, TW;

Inventors:

Wei-Yu Yen, Taichung, TW;

Fu-Bang Chen, Taichung, TW;

Chih-Sung Chang, Taichung, TW;

Assignee:

HIGH POWER OPTO. INC., Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0079 (2013.01);
Abstract

A method for separating a light-emitting diode (LED) from a substrate comprises the following steps. First, a substrate is provided which includes a junction surface and a bottom surface far away from the junction surface. Then a plurality holes are formed on the junction surface. An LED structure is further grown on the junction surface, and includes a junction portion bonded to the junction surface. The bottom surface is then polished to be shrunk to communicate with the holes. Finally, the junction portion is etched by an etching liquid via the holes to separate the LED structure from the substrate. Accordingly, by forming the holes, the LED structure and the substrate can be separated through polishing and etching processes, thereby providing a high yield rate as well as reduced production costs.


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