The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Dec. 17, 2014
Applicant:
Microsoft Corporation, Redmond, WA (US);
Inventors:
Assignee:
Microsoft Technology Licensing, LLC, Redmond, WA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/04 (2006.01); H01L 23/043 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); H01L 23/04 (2013.01); H01L 23/043 (2013.01); H01L 23/367 (2013.01); H01L 23/3733 (2013.01);
Abstract
An electronic device comprises a multi-layer printed circuit board. On the printed circuit board there is installed electronic components and a metal frame that encloses at least part of the electronic components. A layer of bonded anisotropic conductive film is disposed on the frame and the electronic components. The layer connects thermally a sheet of metal foil on the frame and on the electronic components. The sheet of metal foil covers the electronic component and the metal frame.
Pykäri, Lasse. (2015). Thermal management of electronic components (U.S. Patent No. 9224672). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9224672
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile