The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
May. 08, 2012
Applicant:
Robert Ziegler, Traunstein, DE;
Inventor:
Robert Ziegler, Traunstein, DE;
Assignee:
RHODE & SCHWARZ GMBH & CO. KG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); H01L 23/3677 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 23/34 (2013.01); H01L 23/367 (2013.01); H01L 23/3731 (2013.01); H01L 23/49827 (2013.01); H01L 24/48 (2013.01); H01L 2224/27442 (2013.01); H01L 2224/27505 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48237 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83488 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/15787 (2013.01);
Abstract
The circuit arrangement according to the invention provides a substrate (), a connecting element () and a chip (). The substrate () provides at least a partial metallisation () on its surface. The connecting element () is applied to the metallisation (). The chip () is applied to the connecting element (). The connecting element () provides an electrically non-conductive glass layer (), which is applied directly to the metallisation (), and an adhesive layer () between the chip () and the glass layer ().