The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Jun. 06, 2012
Applicants:

Brian R. Smith, Cambridge, MA (US);

Tirunelveli S. Sriram, Acton, MA (US);

Bryan L. Mclaughlin, Cambridge, MA (US);

Inventors:

Brian R. Smith, Cambridge, MA (US);

Tirunelveli S. Sriram, Acton, MA (US);

Bryan L. McLaughlin, Cambridge, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); A61N 1/372 (2006.01); A61N 1/375 (2006.01); A61N 1/362 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); A61N 1/37205 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/97 (2013.01); A61N 1/362 (2013.01); A61N 1/3756 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1461 (2013.01); Y10T 29/49146 (2015.01);
Abstract

An implantable bio-compatible integrated circuit device and methods for manufacture thereof are disclosed herein. The device includes a substrate having a recess. An input/output device including at least one bio-compatible electrical contact is coupled to the substrate in the recess. A layer of hermetic bio-compatible, hermetic insulator material is deposited on a portion of the input/output device. An encapsulating layer of bio-compatible material encapsulates at least a portion of the implantable device, including the input/output device. At least one bio-compatible electrical contact of the input/output device is then exposed. The encapsulating layer and the layer of bio-compatible, hermetic insulator material form a hermetic seal around the at least one exposed bio-compatible electrical contact.


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