The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Mar. 18, 2014
Applicant:
Commissariat a L'energie Atomique ET Aux Ene Alt, Paris, FR;
Inventors:
Tony Maindron, Grenoble, FR;
Nicolas Troc, Troyes, FR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/56 (2006.01); H01L 51/52 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 31/0203 (2014.01); H01L 31/18 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01); H01L 51/44 (2006.01); H01L 51/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 29/66742 (2013.01); H01L 29/786 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01L 51/0001 (2013.01); H01L 51/5203 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 27/3276 (2013.01); H01L 27/3288 (2013.01); H01L 51/107 (2013.01); H01L 51/448 (2013.01); H01L 51/5237 (2013.01);
Abstract
The invention relates to an encapsulation process for an electronic component (). The component () is connected to an electrical contact track composed of a metal layer (). The process according to the invention comprises the following steps: The process according to the invention enables electrical contact through the encapsulation layer (). The invention also relates to an electronic device obtained using such a process.