The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Nov. 12, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Chul Park, Hwaseong-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/00 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H05K 1/11 (2006.01); H01L 23/50 (2006.01); H01L 25/18 (2006.01); H05K 3/28 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G11C 5/063 (2013.01); H01L 23/50 (2013.01); H01L 25/18 (2013.01); H05K 1/113 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49855 (2013.01); H01L 2224/10 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06568 (2013.01); H05K 3/284 (2013.01); H05K 2201/10212 (2013.01);
Abstract
In a semiconductor package, a circuit pattern is arranged in a circuit board and contact pads on the circuit board are connected with the circuit pattern. Contact terminals contact external contact elements on a first surface of the circuit board. An integrated circuit (IC) chip structure is mounted on the circuit board and electrically connected to the inner circuit pattern. An operation controller on the circuit board controls operation of the semiconductor package according to the package users' individual choice.