The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Jul. 19, 2012
Applicants:

Tetsuya Fujino, Chiyoda-Ku, JP;

Masanao Kurihara, Tokyo, JP;

Takashi Shinriki, Tokyo, JP;

Toru Sugamata, Tokyo, JP;

Inventors:

Tetsuya Fujino, Chiyoda-Ku, JP;

Masanao Kurihara, Tokyo, JP;

Takashi Shinriki, Tokyo, JP;

Toru Sugamata, Tokyo, JP;

Assignee:

SUMITOMO OSAKA CEMENT CO., LTD., Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/035 (2006.01); G02B 6/12 (2006.01); G02F 1/01 (2006.01);
U.S. Cl.
CPC ...
G02F 1/035 (2013.01); G02B 2006/1204 (2013.01); G02B 2006/1218 (2013.01); G02F 1/0123 (2013.01); G02F 2201/07 (2013.01); G02F 2202/06 (2013.01); G02F 2202/20 (2013.01); G02F 2203/21 (2013.01);
Abstract

An object of the present invention is to provide a manufacturing method of an optical waveguide element whose DC drift is suppressed, and to provide a manufacturing method of an optical waveguide element, capable of adjusting DC drift in the middle of manufacturing processes so as to improve a fabrication yield. The method of manufacturing an optical waveguide element comprises a step of forming an optical waveguide in a substrate having an electro-optic effect, a step of forming a buffer layer, and a step of forming an electrode, in which one stage or a plurality of stages of an interface diffusion layer heat adjustment step (S, S) for adjusting a concentration distribution of a specific substance in the buffer layer by heating is included after the buffer layer is formed.


Find Patent Forward Citations

Loading…