The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Jul. 29, 2014
Applicant:

Chung Hua University, Hsinchu, TW;

Inventor:

Jium Ming Lin, Hsinchu, TW;

Assignee:

CHUNG HUA UNIVERSITY, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 1/30 (2006.01); G01R 3/00 (2006.01); G01R 31/26 (2014.01); G01R 1/073 (2006.01);
U.S. Cl.
CPC ...
G01R 1/07314 (2013.01); G01R 1/30 (2013.01); G01R 3/00 (2013.01);
Abstract

A vertical probe card includes a bottom substrate, a top substrate, an interposer, a first set of electrically conductive polymer contacts, a second set of electrically conductive polymer contacts, a first anisotropic conductive film, and a second anisotropic conductive film. The interposer is disposed between the bottom substrate and the top substrate. The first set of electrically conductive polymer contacts is disposed on the surface of the bottom substrate opposite to the interposer. The second set of electrically conductive polymer contacts is disposed on the surface of the top substrate opposite to the interposer. The first set of electrically conductive polymer contacts are arranged differently from the second set of electrically conductive polymer contacts. The first anisotropic conductive film is disposed between the bottom substrate and the interposer, and configured to electrically connect the bottom substrate and the interposer. The second anisotropic conductive film is disposed between the interposer and the top substrate, and configured to electrically connect the interposer and the top substrate.


Find Patent Forward Citations

Loading…