The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Aug. 20, 2010
Applicants:

Tianhong Cui, St. Paul, MN (US);

Miao LU, Xiamen, CN;

Inventors:

Tianhong Cui, St. Paul, MN (US);

Miao Lu, Xiamen, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); G01L 1/14 (2006.01); G01L 5/16 (2006.01); A61B 19/00 (2006.01);
U.S. Cl.
CPC ...
G01L 1/142 (2013.01); G01L 5/165 (2013.01); A61B 2019/464 (2013.01); Y10T 29/49117 (2015.01);
Abstract

Methods of manufacturing a flexible force sensor include forming a first sensor part providing a plurality of spaced first electrode plates in an electrically non-conductive material. A second sensor part is also formed and includes a plurality of second electrode plates in an electrically non-conductive material. The second electrode plates are identical to the first electrode plates at least in terms of spacing. The first part is assembled to the second part such that each of the first electrode plates are aligned with and parallel to, yet spaced from, respective ones of the second electrode plates, establishing a plurality of capacitive sensing components. The first electrode plates are movable relative to the corresponding second electrode plates, establishing a variable gap therebetween. The sensor parts can be ring-shaped. The sensor parts can be formed via MEMS techniques, with the non-conductive material being a polymer.


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