The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
May. 17, 2012
Chiho Ito, Otake, JP;
Takeshi Yatsuka, Otake, JP;
Yasuo Kakihara, Otake, JP;
TODA KOGYO CORPORATION, Otake, JP;
Abstract
There are provided copper particles and a copper paste for a copper powder-containing coating film which can be subjected to electroless metal plating without using an expensive catalyst such as palladium, and a process for producing a conductive coating film by subjecting a copper powder-containing coating film formed by using the copper paste to electroless metal plating or heat treatment with superheated steam. The present invention relates to a process for producing a conductive coating film comprising the step of forming a coating film on an insulating substrate using copper particles having an average particle diameter of 0.05 to 2 μm as measured by observation using SEM in which a BET specific surface area value (SSA) (m/g) and a carbon content (C) (% by weight) of the copper particles satisfy a relationship represented the following formula [1]: C/SSA·7×10[1], and a copper paste comprising the copper particles; drying the coating film to obtain a copper powder-containing coating film; and then subjecting the resulting coating film to electroless metal plating or heat treatment with superheated steam.