The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Mar. 04, 2011
Applicants:

Jim Elmore, Houston, TX (US);

Pascale Claeys-bouuaert, Brussels, BE;

Françoise Heine, Dion-Valmont, BE;

Inventors:

Jim Elmore, Houston, TX (US);

Pascale Claeys-Bouuaert, Brussels, BE;

Françoise Heine, Dion-Valmont, BE;

Assignee:

HEXION INC., Columbus, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/46 (2006.01); C08G 59/54 (2006.01); C08G 59/56 (2006.01); C08K 3/08 (2006.01); C08K 3/20 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01); C08K 5/17 (2006.01); C08G 59/18 (2006.01); C09D 163/00 (2006.01); C09J 163/00 (2006.01); C08K 3/10 (2006.01);
U.S. Cl.
CPC ...
C08K 5/17 (2013.01); C08G 59/182 (2013.01); C08G 59/184 (2013.01); C08L 63/00 (2013.01); C09D 163/00 (2013.01); C09J 163/00 (2013.01); C08K 3/10 (2013.01);
Abstract

The invention relates to non aqueous curing agents for water dispersed epoxy resins. The curing agent composition offers a binder pot life of several hours, and in the presence of a metal, such as zinc, nearly no hydrogen generation is observed. The present curing composition can be mixed with a metal powder to provide a storage stable paste. The curing agent composition and/or paste is fully compatible with an epoxy water based resin. After low shear blending, the epoxy curing agent and metal system is storage stable for several hours working pot life that provides for cured coatings having good performance.


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