The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Nov. 16, 2012
Applicant:
Harima Chemicals, Incorporated, Kakogawa-shi, JP;
Inventors:
Yoji Imamura, Kakogawa, JP;
Kazuki Ikeda, Kakogawa, JP;
JinYu Piao, Kakogawa, JP;
Tadashi Takemoto, Tsukuba, JP;
Assignee:
HARIMA CHEMICALS, INCORPORATED, Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 7/10 (2006.01); B23K 35/26 (2006.01); B23K 1/00 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); B23K 35/02 (2006.01); H05K 3/34 (2006.01); B23K 35/22 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 1/00 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 1/092 (2013.01); H05K 3/3463 (2013.01); B23K 35/22 (2013.01);
Abstract
A solder alloy is a tin-silver-copper solder alloy containing tin, silver, copper, nickel, antimony, bismuth, and indium, and substantially does not contain germanium, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, and the antimony content is 0.01 mass % or more and less than 2.5 mass %.