The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9221114 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 29, 2015

Filed:

Dec. 13, 2012
Applicants:

Tianniu Chen, Westford, MA (US);

Michael B. Korzenski, Bethel, CT (US);

Ping Jiang, Danbury, CT (US);

Inventors:

Tianniu Chen, Westford, MA (US);

Michael B. Korzenski, Bethel, CT (US);

Ping Jiang, Danbury, CT (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); B23K 1/018 (2006.01); B09B 3/00 (2006.01); B09B 5/00 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
B23K 1/018 (2013.01); B09B 3/00 (2013.01); B09B 5/00 (2013.01); H05K 3/22 (2013.01); H05K 2203/178 (2013.01); Y02W 30/82 (2015.05); Y02W 30/821 (2015.05);
Abstract

Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.


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Chen, Tianniu. (2015). Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment (U.S. Patent No. 9221114). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9221114

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