The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Apr. 24, 2013
Canon Kabushiki Kaisha, Tokyo, JP;
Koji Tsuduki, Kawasaki, JP;
Takanori Suzuki, Tokyo, JP;
Tadashi Kosaka, Atsugi, JP;
Yasuhiro Matsuki, Atsugi, JP;
Shin Hasegawa, Hadano, JP;
Fujio Ito, Yokohama, JP;
Hisatane Komori, Ayase, JP;
Yasushi Kurihara, Komae, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition α, α, α<αis satisfied, where αis a thermal expansion coefficient of the lid body, αis a thermal expansion coefficient of the frame body, αis a thermal expansion coefficient of the base body, and αis a thermal expansion coefficient of the wiring member.