The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2015

Filed:

Dec. 22, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Hideki Ishigami, Hachinohe, JP;

Hidefumi Nakamura, Hachinohe, JP;

Yukihiko Shiohara, Hachinohe, JP;

Taku Kawasaki, Hachinohe, JP;

Fumiaki Akahane, Hachinohe, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); H01L 41/333 (2013.01); H01L 41/29 (2013.01); B22F 5/12 (2006.01); B22F 3/105 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0475 (2013.01); B22F 3/1055 (2013.01); B22F 5/12 (2013.01); H01L 41/0533 (2013.01); H01L 41/29 (2013.01); H01L 41/333 (2013.01); H05K 1/0306 (2013.01); H05K 2201/0215 (2013.01); H05K 2201/0224 (2013.01);
Abstract

A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.


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