The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Dec. 13, 2012
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Michael Zitzlsperger, Regensburg, DE;
Jürgen Holz, Wenzenbach, DE;
Assignee:
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 33/62 (2010.01); H01L 31/0203 (2014.01); H01L 23/00 (2006.01); H01L 25/13 (2006.01); H01L 33/52 (2010.01); G01R 31/26 (2014.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 22/14 (2013.01); H01L 24/97 (2013.01); H01L 25/13 (2013.01); H01L 31/0203 (2013.01); H01L 33/52 (2013.01); G01R 31/2635 (2013.01); H01L 22/32 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 33/0095 (2013.01); H01L 33/486 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48471 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/19107 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A method serves to produce optoelectronic semiconductor components. A leadframe assemblage includes a number of leadframes. The leadframes each comprise at least two leadframe parts and are connected together at least in part via connecting webs. Electrical connections are attached between neighboring leadframes. A potting body connects the leadframes and the leadframe parts mechanically together. At least some of the connecting webs are removed and/or interrupted, the resulting structure is singulated into the semiconductor components.