The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2015

Filed:

May. 15, 2014
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Raymond Maldan Partosa, Baguio, PH;

Jesus Bajo Bautista, Baguio, PH;

James Raymond Baello, Baguio, PH;

Roxanna Bauzon Samson, Benguet, PH;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/83192 (2013.01);
Abstract

A method of making a flip chip assembly includes a substrate having a top surface and forming a plurality of generally longitudinally extending, laterally spaced apart bond fingers are formed on the top surface. Each of the plurality of bond fingers has a first longitudinal end portion and a second longitudinal end portion. Applying a transversely extending solder resist strip over the first longitudinal end portions of the bond fingers. The strip has an edge wall with a plurality of longitudinally projecting tooth portions separated by gaps. Each tooth portion and each gap aligned with a different one of the bond fingers in each adjacent pair of bond fingers.


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