The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Apr. 17, 2012
Applicants:
Thorsten Meyer, Regensburg, DE;
Grit Sommer, Grafing, DE;
Inventors:
Thorsten Meyer, Regensburg, DE;
Grit Sommer, Grafing, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 23/525 (2006.01); H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/525 (2013.01); H01L 23/3114 (2013.01); H01L 23/522 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 23/5228 (2013.01); H01L 24/24 (2013.01); H01L 24/12 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/82102 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01);
Abstract
A module includes a semiconductor chip and a conductive layer arranged over the semiconductor chip. The module also includes a spacer structure arranged to deflect the conductive layer away from the semiconductor chip.