The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Nov. 13, 2008
Seok Yul Jun, OSan-Si, KR;
Bum Jin Park, Seoul, KR;
Sun IL Kim, Giheung-gu, KR;
Hyong Seok OH, Seoul, KR;
Sung Chul Cho, Gyeonggi, KR;
Young Sam NA, O-San, KR;
Yeon Sang Cho, Seongnam-si, KR;
Ha Sung Song, Gyeonggi-do, KR;
Seong Ju Kim, Kyung Ki Do, KR;
Hee Sang Chae, Gyeonggi, KR;
Talex Sajoto, Campbell, CA (US);
Seok Yul Jun, OSan-Si, KR;
Bum Jin Park, Seoul, KR;
Sun Il Kim, Giheung-gu, KR;
Hyong Seok Oh, Seoul, KR;
Sung Chul Cho, Gyeonggi, KR;
Young Sam Na, O-San, KR;
Yeon Sang Cho, Seongnam-si, KR;
Ha Sung Song, Gyeonggi-do, KR;
Seong Ju Kim, Kyung Ki Do, KR;
Hee Sang Chae, Gyeonggi, KR;
Talex Sajoto, Campbell, CA (US);
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Electrostatic chucks and methods of manufacturing the same are provided herein. In some embodiments, an electrostatic chuck comprises an electrically conductive body having one or more channels formed in an upper surface thereof; a plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized; one or more fluid passages disposed in the plate and fluidly coupling the one or more plenums to the upper surface of the body, wherein the surfaces of the fluid passages are electrically insulated; and a dielectric layer disposed over the upper surface of the body and the plate, wherein the dielectric layer forms a support surface for a substrate to be disposed thereon.