The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2015

Filed:

Aug. 19, 2011
Applicants:

Kazuhiro Harada, Toyama, JP;

Hideharu Itatani, Toyama, JP;

Inventors:

Kazuhiro Harada, Toyama, JP;

Hideharu Itatani, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); C23C 16/52 (2006.01); C23C 16/46 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); H01L 21/67 (2006.01); C23C 16/56 (2006.01); H01L 21/677 (2006.01); H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6719 (2013.01); C23C 16/34 (2013.01); C23C 16/56 (2013.01); H01L 21/67748 (2013.01); H01L 45/04 (2013.01); H01L 45/145 (2013.01); H01L 45/1616 (2013.01);
Abstract

Provided is a method of forming a tantalum oxide-based film having good step coverage while controlling an oxygen concentration in the film. The method includes forming a tantalum nitride layer on a substrate by supplying a source gas including a tantalum and a nitriding agent into a process chamber wherein the substrate is accommodated under a condition where a chemical vapor deposition (CVD) reaction is caused; oxidizing the tantalum nitride layer by supplying an oxidizing agent into the process chamber under a condition where an oxidation reaction of the tantalum nitride layer by the oxidizing agent is unsaturated; and forming on the substrate a conductive tantalum oxynitride film wherein an oxygen is stoichiometrically insufficient with respect to the tantalum and a nitrogen by alternately repeating forming the tantalum nitride layer on the substrate and oxidizing the tantalum nitride layer a plurality of times.


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