The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Oct. 21, 2004
Applicants:
Frank Sieckmann, Bochum, DE;
Gerhard Johannsen, Wettenberg, DE;
Inventors:
Frank Sieckmann, Bochum, DE;
Gerhard Johannsen, Wettenberg, DE;
Assignee:
LEICA MICROSYSTEMS CMS GMBH, Wetzlar, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2006.01); B23K 26/16 (2006.01); A61B 18/16 (2006.01); G01N 1/28 (2006.01); G02B 21/32 (2006.01); G02B 21/36 (2006.01);
U.S. Cl.
CPC ...
G01N 1/2813 (2013.01); G02B 21/32 (2013.01); G02B 21/365 (2013.01); G01N 2001/288 (2013.01);
Abstract
A laser microdissection method includes capturing an electronic image of an image detail of a specimen. The image detail is processed using, image analysis so as to automatically ascertain an object to be cut out. A nominal cutting line around the object to be cut out is automatically defined. Subsequently, the object is cut out in response to a relative motion between a laser beam and the specimen.