The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2015

Filed:

Oct. 28, 2013
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Atsushi Mizuno, Nagoya, JP;

Suguru Kodama, Nagoya, JP;

Yasushi Uchida, Nagoya, JP;

Takahiro Kondo, Nagoya, JP;

Yukio Miyairi, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 39/14 (2006.01); B01D 39/20 (2006.01); B01D 39/06 (2006.01); B01D 24/00 (2006.01); F01N 3/022 (2006.01); B01D 46/24 (2006.01); C04B 35/565 (2006.01); C04B 35/584 (2006.01); C04B 35/626 (2006.01); C04B 35/63 (2006.01); C04B 38/00 (2006.01);
U.S. Cl.
CPC ...
F01N 3/0222 (2013.01); B01D 46/2425 (2013.01); B01D 46/2429 (2013.01); C04B 35/565 (2013.01); C04B 35/584 (2013.01); C04B 35/6263 (2013.01); C04B 35/6316 (2013.01); C04B 38/0009 (2013.01); B01D 46/2444 (2013.01); B01D 46/2448 (2013.01); B01D 2046/2433 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/349 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/3463 (2013.01); C04B 2235/3481 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6584 (2013.01); C04B 2235/663 (2013.01); C04B 2235/80 (2013.01); C04B 2235/96 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/708 (2013.01); F01N 2330/06 (2013.01);
Abstract

A honeycomb filter includes a honeycomb structure and plugged portions. Partition walls of the honeycomb structure are made of a partition wall material including a plurality of aggregates containing silicon carbide or silicon nitride as a main component, and a binding material at a content of 15 to 35 mass %. The binding material is made of a material in which mullite particles as reinforcing particles may be dispersed in cordierite. A thermal expansion coefficient of the partition walls at 40 to 800° C. is 4.2×101/K or less. When a value of a stress applied to the partition wall material at 900° C. is normalized by the maximum value of the stress applied to the partition wall material, a percentage of a plastic deformation displacement in a total displacement at a normalized stress value of 0.9 is in a range of 0.3 to 10%.


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