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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9217053 B1

PDFFull Text
Date of Patent:
Dec. 22, 2015

Filed:

Mar. 19, 2013

Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Etsuko Suzuki, Ichihara, JP;

Kazuo Arita, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:

Locke Lord LLP

Primary Examiner:

Coris Fung

Int. Cl.
CPC ...
B32B 27/08 (2006.01); H05K 1/05 (2006.01); C08L 63/00 (2006.01); C08G 8/32 (2006.01); C08J 5/24 (2006.01); H01L 23/29 (2006.01); H05K 1/03 (2006.01); C08G 16/02 (2006.01); C08L 61/14 (2006.01); H05K 3/00 (2006.01); C08G 8/28 (2006.01); C08G 16/04 (2006.01);
U.S. Cl.
CPC ...
C08G 8/32 (2013.01); C08G 8/28 (2013.01); C08G 16/0243 (2013.01); C08G 16/04 (2013.01); C08J 5/24 (2013.01); C08L 61/14 (2013.01); H01L 23/293 (2013.01); H05K 1/0353 (2013.01); H05K 1/056 (2013.01); H05K 3/0067 (2013.01); C08G 2190/00 (2013.01); C08L 2201/02 (2013.01); C08L 2203/206 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0145 (2013.01);
Abstract

A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.

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