The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2015
Filed:
Jan. 02, 2014
Applicant:
Kabushiki Kaisha Toyota Jidoshokki, Aichi-ken, JP;
Inventor:
Kazuhiro Maeno, Kariya, JP;
Assignee:
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, Aichi-ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); C22C 18/00 (2006.01); C22C 18/04 (2006.01); B23K 35/28 (2006.01); B23K 35/26 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/282 (2013.01); B23K 35/264 (2013.01); B23K 35/286 (2013.01); H01L 24/29 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/351 (2013.01);
Abstract
A solder includes zinc as a main component and the solder contains 6 to 8 mass percent of indium. A solder includes zinc as a main component, wherein the solder contains only indium. In a die-bonding structure in which a semiconductor chip is connected to a bonded member by a solder, the solder made of zinc as a main component and contains indium.