The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 22, 2015

Filed:

Nov. 20, 2009
Applicants:

Brian Hann, Avondale, AZ (US);

Derek Anthony Rice, Phoenix, AZ (US);

Daniel Greving, Scottsdale, AZ (US);

Inventors:

Brian Hann, Avondale, AZ (US);

Derek Anthony Rice, Phoenix, AZ (US);

Daniel Greving, Scottsdale, AZ (US);

Assignee:

HONEYWELL INTERNATIONAL INC., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/15 (2006.01); B22F 3/24 (2006.01); C22C 19/05 (2006.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
B22F 3/24 (2013.01); C22C 19/056 (2013.01); B22F 5/003 (2013.01); B22F 2998/10 (2013.01); F05D 2220/31 (2013.01);
Abstract

Methods of forming dual microstructure components include consolidating a powder material comprising an alloy to form a billet, the billet having a first grain structure, inductively heating the billet at an inductive heat treat temperature above a gamma prime solvus temperature of the alloy and subjecting the billet to a subsolvus heat treat temperature that is below the gamma prime solvus temperature of the alloy, waiting a period of time for the first grain structure in an outer portion of the billet to transform into a second grain structure that is coarser than the first grain structure, after the steps of inductively heating and subjecting the billet to the subsolvus heat treat temperature. The methods also include dividing the billet into at least two sections, and machining a final shape into one or more of the at least two sections to form the dual microstructure component.


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