The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Dec. 02, 2013
Applicant:
Smartrac Technology Gmbh, Dresden, DE;
Inventors:
Carsten Nieland, Gotha, DE;
Frank Kriebel, Lichtenberg, DE;
Assignee:
SMARTRAC TECHNOLOGY GmbH, Dresden, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/18 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H05K 3/30 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01L 21/76885 (2013.01); H01L 23/49811 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H05K 3/301 (2013.01); H01L 24/11 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81206 (2013.01); H01L 2224/81898 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/00014 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10954 (2013.01);
Abstract
Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.