The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Dec. 25, 2012
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya, Aichi, JP;

Inventors:

Jyun Suzuki, Nagoya, JP;

Naoki Kito, Nagoya, JP;

Masami Hasegawa, Konan, JP;

Chizuo Nakashima, Tajimi, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 3/0052 (2013.01); H05K 1/183 (2013.01); H05K 3/403 (2013.01); H05K 2201/0909 (2013.01); H05K 2201/0919 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/09354 (2013.01);
Abstract

A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface.


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