The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Mar. 23, 2014
Applicant:
Nanya Technology Corporation, Tao-Yuan Hsien, TW;
Inventor:
Tsugio Takahashi, Ibaraki, JP;
Assignee:
NANYA TECHNOLOGY CORPORATION, Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 3/289 (2006.01); H03K 3/3562 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H03K 3/3562 (2013.01); H01L 23/481 (2013.01); H01L 25/0657 (2013.01);
Abstract
A three dimensional integrated circuit includes a master circuit, a slave circuit, and a through-silicon via (TSV). The master circuit is configured to receive and process an input data, a data strobe signal (DQS) and an input command to output a writing data signal to a master die. The through-silicon via (TSV) is electrically coupled between the master circuit and the slave circuit. The master circuit is configured to transfer the writing data signal to a slave die through the TSV. Furthermore, a method for controlling a three dimensional integrated circuit is disclosed herein.