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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9214606 B1

PDFFull Text
Date of Patent:
Dec. 15, 2015

Filed:

Mar. 10, 2014

Method of manufacturing light-emitting diode package

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Il-woo Park, Suwon-si, KR;

Jong-rak Sohn, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Michael Trinh

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/46 (2010.01); H01L 33/60 (2010.01); H01L 33/38 (2010.01); H01L 23/00 (2006.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/46 (2013.01); H01L 24/32 (2013.01); H01L 33/38 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A method of manufacturing a light-emitting diode package is illustrated. A light-emitting diode chip is manufactured. A material layer is formed on side surfaces and a rear surface of the light-emitting diode chip. The material layer is then oxidized to convert the material layer into an oxidized layer to form a reflective layer on the side surfaces and the rear surface of the light-emitting diode chip. The light-emitting diode chip is packaged.

Find Patent Forward Citations

Park, Il-woo. (2015). Method of manufacturing light-emitting diode package (U.S. Patent No. 9214606). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9214606

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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