The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Apr. 22, 2011
Applicant:

Paul F. Lamarche, Morgan Hill, CA (US);

Inventor:

Paul F. Lamarche, Morgan Hill, CA (US);

Assignee:

Solar Junction Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/042 (2014.01); H01L 31/00 (2006.01); H01L 31/048 (2014.01); H01L 31/052 (2014.01); H01L 31/02 (2006.01); H01L 31/05 (2014.01);
U.S. Cl.
CPC ...
H01L 31/048 (2013.01); H01L 31/02008 (2013.01); H01L 31/052 (2013.01); H01L 31/0504 (2013.01); Y02E 10/50 (2013.01);
Abstract

A package for a solar cell is provided having laminates formed by stacked lead frames to form an integral package supporting a solar cell structure. Lead frames serve as a heat sink, raised portions match a cavity in a middle lead frames that contain and hold individual solar cell chips in place. Beveled interior edges of a carrier lead frame are in electrical contact with bus bars on the periphery of a suspended solar cell and form the electrical connection for the cell, maximizing current handling capability and allowing the use of spring tension and/or a bonding compound for additional connection strength and integrity. Such a 'stackable' semiconductor package requires no ribbon bonding and has multiple bias options, maximum scalability, enhanced moisture resistance, and multiple attachment options for heat sink attachment.


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