The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Mar. 31, 2014
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Motoi Yamauchi, Kanagawa, JP;
Osamu Kawachi, Kanagawa, JP;
Yasushi Fukuda, Kanagawa, JP;
Yoshinobu Ishibashi, Kanagawa, JP;
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/02 (2006.01); H03H 9/05 (2006.01); H01L 23/15 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H05K 1/0271 (2013.01); H01L 23/15 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81206 (2013.01); H01L 2224/81207 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/97 (2013.01); H01L 2924/351 (2013.01); H03H 9/059 (2013.01); H05K 1/0306 (2013.01); H05K 3/3431 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/2009 (2013.01);
Abstract
An electronic component includes: a substrate formed of ceramic and including one or more pads on an upper surface thereof; a component flip-chip mounted on the upper surface of the substrate with one or more bumps bonded to the one or more pads; and an additional film located on a lower surface of the substrate and overlapping with at least a part of a smaller one of the pad and the bump in each of one or more pad/bump pairs, the one or more pad/bump pairs being composed of the one or more pads and the one or more bumps bonded to each other.