The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
May. 21, 2014
Heungkyu Kwon, Seongnam-si, KR;
Kyoungmook Lim, Hwaseong-si, KR;
Heungkyu Kwon, Seongnam-si, KR;
Kyoungmook Lim, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
According to example embodiments, a semiconductor package includes a first and a second semiconductor package. The first semiconductor package includes a first package substrate, first and second memory chips spaced apart from each other on the first package substrate in a first direction, third and fourth memory chips on the first and second memory chips, respectively, and first and second jumper chips on the first and second memory chips, respectively. The first and second jumper chips are spaced apart from the third and fourth memory chips, respectively, in a second direction crossing the first direction. The second semiconductor package may include a second package substrate and a logic chip on the second package substrate. The first semiconductor package may be on the second semiconductor package.