The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Jul. 11, 2014
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Siamak Fazelpour, San Diego, CA (US);
Priyatharshan Pathmanathan, Raleigh, NC (US);
John Stephen Loffink, Wake Forest, NC (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 28/10 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/19042 (2013.01);
Abstract
Methods and apparatuses for reducing excess on die capacitance. The method couples a first die pad to a first via. The method couples a second die pad to a second via. The method couples a first inductor to the first die pad and the second via. The method couples a second inductor to the second die pad and the first via.