The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Apr. 04, 2014
Applicant:

SK Hynix Inc., Icheon-si Gyeonggi-do, KR;

Inventors:

Jong Hoon Kim, Suwon-si, KR;

Han Jun Bae, Icheon-si, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 23/3171 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05605 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05613 (2013.01); H01L 2224/05616 (2013.01); H01L 2224/05618 (2013.01); H01L 2224/05623 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81898 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Stack packages are provided. The stack package includes a first chip and a second chip. The first chip includes a first chip body, first through electrodes penetrating the first chip body, and an insulation layer disposed on a bottom surface of the first chip body. The second chip includes a second chip body and bumps disposed on a top surface of the second chip body. The first and second chips are vertically stacked such that the bumps penetrate the insulation layer to pierce the first through electrodes and the top surface of the second chip body directly contacts the insulation layer. Related fabrication methods, electronic systems and memory cards are also provided.


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