The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Dec. 22, 2014
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Tomoaki Yoshimi, Kariya, JP;

Takayuki Uchida, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 23/053 (2006.01); H01L 23/24 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 23/34 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 24/32 (2013.01); H01L 25/0655 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/13055 (2013.01);
Abstract

In an electronic control device, semiconductor modules are disposed in a power region of a substrate, and on a surface of a substrate adjacent to a housing to radiate heat from rear surfaces to the housing through a heat radiation layer. Therefore, a heat radiation performance improves. Further, a first distance from an end surface of a power region corresponding part corresponding to the power region to the substrate is shorter than a second distance from an end surface of a control region corresponding part corresponding to a control region of the substrate to the substrate. Therefore, a closed circuit bridged by parasitic capacitances is formed mainly in an area of the power region and the power region corresponding part. A noise generated from the semiconductor modules is returned to noise sources through the closed circuit without affecting the control region.


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