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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9214374 B1

PDFFull Text
Date of Patent:
Dec. 15, 2015

Filed:

Mar. 13, 2012

Semiconductor devices including stress relief structures

Applicants:

Dosun Lee, Gwangju, KR;

Kiyoung Yun, Suwon-si, KR;

Yeonglyeol Park, Yongin-si, KR;

Gilheyun Choi, Seoul, KR;

Kisoon Bae, Yongin-si, KR;

Kwangjin Moon, Suwon-si, KR;

Inventors:

Dosun Lee, Gwangju, KR;

Kiyoung Yun, Suwon-si, KR;

Yeonglyeol Park, Yongin-si, KR;

Gilheyun Choi, Seoul, KR;

Kisoon Bae, Yongin-si, KR;

Kwangjin Moon, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., , KR;

Attorney:

Myers Bigel Sibley & Sajovec, PA

Primary Examiner:

Cheung Lee

Assistant Examiner:

Stephen Bradley

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/58 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/585 (2013.01); H01L 23/3128 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05684 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A microelectronic device includes a substrate having at least one microelectronic component on a surface thereof, a conductive via electrode extending through the substrate, and a stress relief structure including a gap region therein extending into the surface of the substrate between the via electrode and the microelectronic component. The stress relief structure is spaced apart from the conductive via such that a portion of the substrate extends therebetween. Related devices and fabrication methods are also discussed.

Find Patent Forward Citations

Lee, Dosun. (2015). Semiconductor devices including stress relief structures (U.S. Patent No. 9214374). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9214374

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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