The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Apr. 24, 2014
Applicant:

Rf Micro Devices, Inc., Greensboro, NC (US);

Inventors:

Michael Carroll, Jamestown, NC (US);

Julio Costa, Oak Ridge, NC (US);

Daniel Charles Kerr, Oak Ridge, NC (US);

Don Willis, Kernersville, NC (US);

Elizabeth Glass, Oak Ridge, NC (US);

Assignee:

RF Micro Devices, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/02 (2006.01); H01L 21/02 (2006.01); H01L 23/29 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 21/683 (2006.01); H01L 29/786 (2006.01); H01L 29/06 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0237 (2013.01); H01L 21/6835 (2013.01); H01L 23/293 (2013.01); H01L 23/36 (2013.01); H01L 23/3737 (2013.01); H01L 29/78606 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 29/0657 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/13 (2013.01);
Abstract

A semiconductor device and methods for manufacturing the same are disclosed. The semiconductor device includes a semiconductor stack structure attached to a wafer handle having at least one aperture that extends through the wafer handle to an exposed portion of the semiconductor stack structure. A thermally conductive and electrically resistive polymer substantially fills the at least one aperture and contacts the exposed portion of the semiconductor stack structure. One method for manufacturing the semiconductor device includes forming patterned apertures in the wafer handle to expose a portion of the semiconductor stack structure. The patterned apertures may or may not be aligned with sections of RF circuitry making up the semiconductor stack structure. A following step includes contacting the exposed portion of the semiconductor stack structure with a polymer and substantially filling the patterned apertures with the polymer, wherein the polymer is thermally conductive and electrically resistive.


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