The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Dec. 01, 2011
Applicants:
Katsuhiko Miya, Kyoto, JP;
Naozumi Fujiwara, Kyoto, JP;
Inventors:
Katsuhiko Miya, Kyoto, JP;
Naozumi Fujiwara, Kyoto, JP;
Assignee:
SCREEN Holdings Co., Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 7/00 (2006.01); B08B 3/10 (2006.01); B08B 3/12 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02052 (2013.01); B08B 3/10 (2013.01); B08B 3/12 (2013.01); B08B 7/0021 (2013.01); H01L 21/02 (2013.01); H01L 21/67051 (2013.01); H01L 21/67196 (2013.01);
Abstract
DIW in an excessively cooled state is supplied as a solidification liquid to a substrate W, and a solidified material of the DIW is formed by a landing impact on the substrate W. This makes the use of a gaseous refrigerant necessary to form a solidified material unnecessary, eliminates the need for a facility to generate the gaseous refrigerant, shortens a processing time and further enables running cost and the like to be suppressed.