The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Mar. 06, 2014
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Fumio Watanabe, Tokyo, JP;

Naozumi Ishikawa, Tokyo, JP;

Hiroshi Kamiyama, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 27/29 (2013.01); H01F 41/042 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0093 (2013.01); Y10T 29/4902 (2015.01);
Abstract

An electronic component includes a first conductor layer including a first conductor pattern P, a first insulating layer covering the first conductor layer, a first opening hpassing through the first insulting layer to expose top and side surfaces of the first conductor pattern Ptherethrough, and a second conductor layer formed on the first insulating layer and including a second conductor pattern Pconnected to the first conductor pattern Pthrough the first opening h. A first opening region which is a planar region inside the first opening hincludes a first region in which the first conductor pattern Pis formed and a second region in which the first conductor pattern Pis not formed. The second conductor pattern Pis embedded in both the first and second regions of the first opening h


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