The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Aug. 11, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-Fu, JP;

Inventors:

Hiroshige Adachi, Nagaokakyo, JP;

Seiji Fujita, Nagaokakyo, JP;

Kazuhiro Kaneko, Nagaokakyo, JP;

Satoru Adachi, Nagaokakyo, JP;

Sadaaki Sakamoto, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 3/12 (2006.01); B32B 7/02 (2006.01); C04B 35/20 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); B32B 18/00 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); C04B 35/462 (2006.01); C04B 35/478 (2006.01); C04B 35/626 (2006.01); H01G 4/10 (2006.01); C04B 35/443 (2006.01);
U.S. Cl.
CPC ...
H01B 3/12 (2013.01); B32B 7/02 (2013.01); B32B 18/00 (2013.01); C04B 35/20 (2013.01); C04B 35/443 (2013.01); C04B 35/462 (2013.01); C04B 35/478 (2013.01); C04B 35/62685 (2013.01); H01G 4/105 (2013.01); H01G 4/12 (2013.01); H01G 4/129 (2013.01); H01G 4/1209 (2013.01); H01G 4/1218 (2013.01); H01G 4/30 (2013.01); H05K 3/4629 (2013.01); H05K 3/4688 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3222 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3445 (2013.01); C04B 2235/3481 (2013.01); C04B 2235/36 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/80 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/62 (2013.01); H05K 1/024 (2013.01); H05K 2201/10371 (2013.01); Y10T 428/24942 (2015.01);
Abstract

A composite laminated ceramic electronic component that includes co-fired low dielectric-constant ceramic layers and high dielectric-constant ceramic layers. The low dielectric-constant ceramic layers and the high dielectric-constant ceramic layers are each composed of a glass ceramic containing: a first ceramic composed of MgAlOand/or MgSiO; a second ceramic composed of BaO, REO(where RE is a rare-earth element), and TiO; glass containing each of 44.0 to 69.0 weight % of RO (where R is an alkaline-earth metal), 14.2 to 30.0 weight % of SiO, 10.0 to 20.0 weight % of BO, 0.5 to 4.0 weight % of AlO, 0.3 to 7.5 weight % of LiO, and 0.1 to 5.5 weight % of MgO; and MnO. The content ratios of the glass, etc. are varied between the low dielectric-constant ceramic layers and the high dielectric-constant ceramic layers.


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