The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Aug. 06, 2012
Applicants:

Camil-daniel Ghiu, Danvers, MA (US);

Sarah Bazydola, Belmont, MA (US);

Napoli Oza, Boise, ID (US);

Inventors:

Camil-Daniel Ghiu, Danvers, MA (US);

Sarah Bazydola, Belmont, MA (US);

Napoli Oza, Boise, ID (US);

Assignee:

OSRAM SYLVANIA Inc., Wilmington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 21/00 (2006.01); F21V 9/16 (2006.01); F21V 11/00 (2015.01); F21K 99/00 (2010.01); H05K 1/18 (2006.01); F21V 29/70 (2015.01); F21Y 101/02 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
F21K 9/00 (2013.01); F21K 9/56 (2013.01); F21V 29/70 (2015.01); H05K 1/183 (2013.01); F21Y 2101/02 (2013.01); H05K 1/05 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A solid state light source module having a compact, thermally enhanced substrate with one or more recessed pockets, is provided. The module includes a solid state light source and an electrical connection for the solid state light source, such that it is able to receive power so as to generate light. The solid state light source is connected to a substrate having an upper surface and a lower surface. The substrate includes a recessed pocket in the upper surface, defined by a wall and a floor that are at least large enough to accommodate the solid state light source; thus, the solid state light source sits within the recessed pocket. This allows the module to be substantially flat, even with an attached optical system, even utilizing remote phosphor technology, and increases the amount of heat dissipated by a thermal management system that is part of, or connected to, the module.


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