The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2015

Filed:

Feb. 09, 2007
Applicant:

Wolfgang Puest, Hofheim-Wallau, DE;

Inventors:

Wolfgang Puest, Hofheim-Wallau, DE;

Rolf Steinmetz, Hofheim-Wildsac, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/72 (2006.01); B29C 49/64 (2006.01); B29B 11/08 (2006.01); B29B 11/14 (2006.01); B29C 49/06 (2006.01); B29C 35/16 (2006.01); B29K 67/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/7207 (2013.01); B29C 49/6463 (2013.01); B29B 11/08 (2013.01); B29B 11/14 (2013.01); B29B 2911/1402 (2013.01); B29B 2911/1404 (2013.01); B29B 2911/14026 (2013.01); B29B 2911/14033 (2013.01); B29B 2911/1444 (2013.01); B29B 2911/14106 (2013.01); B29B 2911/14133 (2013.01); B29B 2911/14326 (2013.01); B29B 2911/14333 (2013.01); B29B 2911/14466 (2013.01); B29C 49/06 (2013.01); B29C 49/6436 (2013.01); B29C 2035/1666 (2013.01); B29K 2067/00 (2013.01); B29K 2105/253 (2013.01);
Abstract

A system and method for post-treatment of a hollow body molding produced in an injection molding mold. A receiving finger is provided with a first end and a second end. The receiving finger is designed that it can engage into the hollow body molding. The outside shape of the receiving finger substantially corresponds to inside shape of the hollow body molding so that the receiving finger () can hold the hollow body molding. Preferably, the outside diameter of the receiving finger is substantially equal to inside diameter of the hollow body molding in a cooled condition so that the hollow body molding can be removed from the receiving finger even after shrinkage. Desirably, the outside diameter of the receiving finger is between about 0.01 mm and about 1 mm and preferably about 0.1 to about 0.5 mm smaller than the inside diameter of the hollow body preform in the removal condition so that the hollow body molding can be removed from the receiving finger even after shrinkage. An apparatus is desirably provided for at least one of cooling and heating the hollow body molding so that the hollow body molding can be selectively cooled or heated by means of the system.


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