The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2015
Filed:
Jun. 03, 2011
Takashi Iseki, Tokyo, JP;
Takashi Iseki, Tokyo, JP;
SUMITOMO METAL MINING CO., LTD., Tokyo, JP;
Abstract
A Pb-free solder alloy whose residual stress during solidification is small and which achieves high joint strength and high reliability, can suppress a reaction between Ni and Bi or diffusion of Ni when used to join Ni-containing electronic parts or substrates, and can withstand a high reflow temperature. A first aspect of a Pb-free solder alloy consists of 0.03% by mass or more but 0.70% by mass or less of Al, 0.2% by mass or more but 14.0% by mass or less of Zn, and the balance being Bi except for inevitable impurities. A second aspect of a Pb-free solder alloy consists of 0.03% by mass or ore but 0.70% by mass or less of Al, 0.2% by mass or more but 14.0% by mass or less of Zn, not more than 0.500% by mass of P, and the balance being Bi except for inevitable impurities.