The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Jan. 24, 2012
Applicant:
Joel S. Douglas, Groton, CT (US);
Inventor:
Joel S. Douglas, Groton, CT (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/04 (2006.01); H01B 1/06 (2006.01); H05K 1/09 (2006.01); H01B 1/24 (2006.01); B82Y 10/00 (2011.01); B82Y 30/00 (2011.01); H05K 3/36 (2006.01); H05K 3/24 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/095 (2013.01); B82Y 10/00 (2013.01); B82Y 30/00 (2013.01); H01B 1/24 (2013.01); H05K 3/361 (2013.01); H05K 3/245 (2013.01); H05K 3/328 (2013.01); H05K 3/363 (2013.01); H05K 2201/026 (2013.01); H05K 2201/0323 (2013.01); H05K 2203/0285 (2013.01);
Abstract
A bondable conductive ink comprising carbon nanotubes, larger diameter conductive particles having at least one dimension of at least 100 nanometers which are not carbon nanotubes, a polymer, and a solvent, and a method of producing this bondable conductive ink. The ink is highly suitable for producing circuit assemblies having non-conductive substrates upon which printed conductors, formed from the bondable conductive ink, may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.