The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

May. 29, 2013
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-Shi, Kyoto-fu, JP;

Inventors:

Kosuke Nakano, Nagaokakyo, JP;

Hidekiyo Takaoka, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 31/02 (2006.01); H01R 4/02 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 9/05 (2006.01); C22C 9/06 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
H01R 4/02 (2013.01); B23K 1/00 (2013.01); B23K 1/0016 (2013.01); B23K 35/0238 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 3/3463 (2013.01); H05K 2201/0272 (2013.01); Y10T 403/479 (2015.01);
Abstract

A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.


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