The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Mar. 18, 2014
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Kalpendu Shastri, Orefield, PA (US);

Bipin Dama, Bridgewater, NJ (US);

Mark Webster, Bethlehem, PA (US);

David Piede, Allentown, PA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01P 3/00 (2006.01); G02F 1/01 (2006.01); H05K 1/02 (2006.01); G02F 1/03 (2006.01); G02F 1/225 (2006.01);
U.S. Cl.
CPC ...
H01P 3/00 (2013.01); G02F 1/011 (2013.01); G02F 1/0121 (2013.01); G02F 1/0327 (2013.01); G02F 1/225 (2013.01); H05K 1/0245 (2013.01); G02F 1/2255 (2013.01); G02F 2201/124 (2013.01); G02F 2201/126 (2013.01); H05K 2201/09245 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.


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