The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2015

Filed:

Jan. 09, 2014
Applicant:

Sabic Global Technologies B.v., Bergen op Zoom, NL;

Inventors:

Roy Martinus Adrianus L'Abee, Veldhoven, NL;

Tony Farrell, Bergen op Zoom, NL;

Assignee:

SABIC Global Technologies B.V., Bergen op Zoom, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/16 (2006.01); H01M 2/14 (2006.01); C08F 110/02 (2006.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); H01M 8/10 (2006.01); H01G 11/52 (2013.01); H01M 4/68 (2006.01); H01G 9/02 (2006.01);
U.S. Cl.
CPC ...
H01M 2/145 (2013.01); B23K 26/381 (2013.01); B23K 26/385 (2013.01); B23K 26/4065 (2013.01); C08F 110/02 (2013.01); H01G 11/52 (2013.01); H01M 2/162 (2013.01); H01M 2/1653 (2013.01); H01M 2/1666 (2013.01); H01M 8/1067 (2013.01); H01M 8/1069 (2013.01); H01M 8/1079 (2013.01); H01G 9/02 (2013.01); Y02E 60/521 (2013.01); Y10T 428/24273 (2015.01); Y10T 428/24322 (2015.01);
Abstract

The disclosure relates, in one aspect, to porous solid-state films with controlled pore structures obtained by laser perforation. A thin laser-perforated film can comprise a slab defining a plurality of pores distributed in a predetermined arrangement, the plurality of pores having a distribution of sizes bound by a predetermined magnitude. In an aspect, the plurality of pores are formed in the slab with a laser having a wavelength less than about 400 nm and the slab has a transmission of the laser light of equal to or less than about 70% measured at a thickness of the slab of 100 micrometer or less.


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